Homepage


Greetings, I am Dewinda, and I am delighted to have you on my webpage!

I am a Doctoral candidate in Computer Science. My research is centered around the application of Deep Learning for medical imaging.

Here, you can find a combination of personal and professional details about me.

Updates

Aug. 2024: Our work "Lite FBCN: Lightweight Fast Bilinear Convolutional Network for Brain Disease Classification from MRI Image" has been accepted for publication at EMITTER International Journal of Engineering Technology.
Jul. 2024:Excited to be invited as a reviewer for FAIMI workshop at MICCAI 2024๐Ÿง
May. 2024:I have joined the activity committee for the FAIMI๐Ÿ’ผ Looking forward to supporting the community!
Mar. 2024:Excited to be invited as a reviewer for the MIDL 2024! ๐Ÿง Iโ€™ll be reviewing two papers related to my experience in brain MRI analysis. Learn more about my first reviewing experience here
Oct. 2023:Thrilled to receive the Best Poster Presentation Award for my paper 'How You Split Matters' at MICCAI FAIMI Workshop 2023! ๐Ÿ†๐ŸŽ‰Check out the winning poster here
Aug. 2023: My work "How You Split Matters: Data Leakage and Subject Characteristics Studies in Longitudinal Brain MRI Analysis" has been accepted for publication at MICCAI FAIMI 2023 workshop. Congratulations!
April. 2023: Our work "Deep-Stacked Convolutional Neural Networks for Brain Abnormalities Classification Based on MRI Images" has been accepted for publication at Journal of Digital Imaging (Springer). Congratulations!
Nov. 2022: I have started a research visit in the Bio-Imaging Laboratory at Kyung Hee University, South Korea (supervised by Prof. Tae-Seong Kim). Excited to be in Suwon, South Korea for 5 months.
Sep. 2022: I have received a grant from the Directorate General of Higher Education and Research Technology, Indonesia to conduct a research abroad.
Aug. 2022: Our work "The Effect of Noisy and Blurry Data on Deep Learning: Application in Brain Image Classification" has been accepted for publication at IEEE Region 10 Conference (TENCON) 2022.